Interfacial Adhesion Failure in Semiconductor Packages
نویسندگان
چکیده
منابع مشابه
Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages
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ژورنال
عنوان ژورنال: Journal of The Adhesion Society of Japan
سال: 2002
ISSN: 0916-4812,2187-4816
DOI: 10.11618/adhesion.38.477